Cores, strip wound, for electromagnetic compatibility (EMC) applications
Our company was established in 1992 with about 3,000 employees,total land area up to 101,000 square meters , and floor area up to 81,000 square meters. We specialize in PCB manufacturing for more than 20 years.
With foresight management, we insist on "providing excellent quality products". We provide nearly error-free products and overall structured service in order to satisfy customer's needs.
What products and services we offer:
Excepting OEM PCB, i.e. Telecommunication, PC Add-On Card, IT Application, Network Device, Multi Layers FR-4 product, we have some outstanding products as follows:
1. Carbon Built on PCB:Apply for Thick Film Technology to make the PCB with buried resistors or touch pad function.
2. Thin PCB:Less than 16 mil thickness in 4 or 6 layers FR-4 production is another challenge for our production capability.
3. CSP // BGA PCB:Those kinds of PCB are increasing and we expect the quantity will be over 10% of our production in coming years.
4. Special Service: In addition to devote in normal PCB process, our engineering team also provide design support as requested by clients.
Our Strength:
Excellent quality stability.
Excellent process and handling control. (Thus impedance yield can achieve to 98% !)
High customer satisfaction.
Thin Board Production with 2 mils core.
Different Impedance technique leader in the RAM module market.
Tight board thickness tolerance(+/- 3 mils) control.
Process Capability |
Feature | Process Capability | Figure |
Line Width/Space | H oz ( inner-layer ) | Min.2.0/2.0mil (0.05/0.05mm) | Bitmap |
1 oz ( inner-layer ) | Min.2.4/2.4mil (0.060/0.060mm) |
2 oz ( inner-layer ) | Min.4.0/5.0mil (0.10/0.05mm) |
1/3 oz ( outer-layer ) | Min.2.0/2.0mil (0.05/0.05mm) |
H oz ( outer-layer ) | Min.3.0/3.0mil (0.076/0.076mm) |
Impedance | Microstrip | +/- 10% | Bitmap |
Differential | +/- 10% |
Warpage | Long side | </= 0.7% | Bitmap |
Working Panel Size | Max. | 21" x 24" ( 5334 x 6096mm) | Bitmap |
Laminate | Type | FR4 ( Tg150/Tg180) | Bitmap |
Halogen-free |
Cooper Thickness for laminate | 1/3 oz; H oz; 1 oz; 2 oz; 3 oz |
Layer Count | 2-24L |
Finished Thickness | 8~126mil (0.2~3.2mm) |
2L | Min. 8mil (0.20mm) |
4L | Min. 14mil (0.35mm) |
6L | Min. 18mil (0.45mm) |
8L | Min. 28mil (0.70mm) |
10L | Min. 32mil (0.80mm) |
12~14L | Min. 40mil (1.00mm) |
16L~18L | Min. 50mil (1.27mm) |
20L | Min. 54mil (1.37mm) |
Solder Mask | Process | Print or Spray-coating | Bitmap |
Color | Green; Blue; Red; Black |
Clearance | Min. 1mil (0.0254mm) |
Solder-dam | Min. 3mil (0.075mm) |
Surface Treatment | ENIG ( immersion gold ) | Au(min):1~3u"(0.0254~0.076um), Ni(min):120u"( 3um) | Bitmap |
Hard Gold Plating | Au: 3~80u" (0.076~2.0um), Ti(min):120u"(3um) |
OSP | 8~16U"(0.2~0.4um) |
Immersion Silver | 7~15u"(0.178~0.38um) |
Immersion Tin | 10~50u"(0.25~1.27um) |
ENEPIG | Au(min):1~3u"(0.0254~0.076um), Ni (min):120u"(3um), Pd(min):1~4u"(0.0254~0.1um) |
Outline | CNC Tolerance | +/- 3mil (0.076mm) |
V-CUT Accuracy | +/- 3mil (0.076mm) |
V-CUT Angle | 30~60° |
Diagonal Chamfer Depth | 45°/2~8mil ( 0.05~0.2mm) |
Punch Tolerance | +/-2mil ( 0.15mm ) |
Hole | Min. Finished Hole Size | Mechanical 6mil (0.15mm) |
Drill Tolerance | PTH +/- 3mil(0.076MM) NPTH +/- 2mil (0.05mm) |
Inner Tolerance | Min. 5mil ( 0.127mm) |
Max. Aspect Ratio | 12:01 |
Before quote, please offer:
Gerber fileBase material: FR4/ AL/ FPC/ CEM-1/ CEM-3/ 94v0/ RogersBoard thickness
Following pictures of PCB we did for your reference: